Co-Integrated PIN-PMN-PT 2-D Array and Transceiver Electronics by Direct Assembly Using a 3-D Printed Interposer Grid Frame
| Autor: | Douglas N. Stephens, Robert Gideon Wodnicki, Ruimin Chen, Victoria Chiu, Qifa Zhou, Katherine W. Ferrara, Yu Liu, Hayong Jung, Nestor E. Cabrera-Munoz, Josquin Foiret, Laiming Jiang, Haochen Kang |
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| Rok vydání: | 2020 |
| Předmět: |
Electromechanical coupling coefficient
Materials science Acoustics and Ultrasonics business.industry Integrated circuit Multiplexing Article law.invention CMOS Application-specific integrated circuit Gate array law Hardware_INTEGRATEDCIRCUITS Interposer Optoelectronics Electrical and Electronic Engineering business Field-programmable gate array Instrumentation |
| Zdroj: | IEEE Trans Ultrason Ferroelectr Freq Control |
| ISSN: | 1525-8955 0885-3010 |
| DOI: | 10.1109/tuffc.2019.2944668 |
| Popis: | Tiled modular 2-D ultrasound arrays have the potential for realizing large apertures for novel diagnostic applications. This work presents an architecture for fabrication of tileable 2-D array modules implemented using 1–3 composites of high-bandwidth (BW) PIN-PMN-PT single-crystal piezoelectric material closely coupled with high-voltage CMOS application-specific integrated circuit (ASIC) electronics for buffering and multiplexing functions. The module, which is designed to be operated as a $\lambda $ -pitch 1.75-D array, benefits from an improved electromechanical coupling coefficient and increased Curie temperature and is assembled directly on top of the ASIC silicon substrate using an interposer backing. The interposer consists of a novel 3-D printed acrylic frame that is filled with conducting and acoustically absorbing silver epoxy material. The ASIC comprises a high-voltage switching matrix with locally integrated buffering and is interfaced to a Verasonics Vantage 128, using a local field programmable gate array (FPGA) controller. Multiple prototype $5 \times 6$ element array modules have been fabricated by this process. The combined acoustic array and ASIC module was configured electronically by programming the switches to operate as a 1-D array with elements grouped in elevation for imaging and pulse-echo testing. The resulting array configuration had an average center frequency of 4.55 MHz, azimuthal element pitch of $340~\mu \text{m}$ , and exhibited average −20-dB pulsewidth of 592 ns and average −6-dB fractional BW of 77%. |
| Databáze: | OpenAIRE |
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