Thermal Cycling of (RE)BCO-Based Superconducting Tapes Joined by Lead-Free Solders
| Autor: | L. Frolek, Michal Skarba, Martin Necpal, Eva Cuninková, Marcela Pekarčíková |
|---|---|
| Rok vydání: | 2021 |
| Předmět: |
musculoskeletal diseases
Materials science High-temperature superconductivity Scanning electron microscope 02 engineering and technology Temperature cycling 01 natural sciences lcsh:Technology Article law.invention law Electrical resistivity and conductivity thermal cycling 0103 physical sciences Thermal General Materials Science Composite material 010306 general physics lcsh:Microscopy Joint (geology) lcsh:QC120-168.85 Superconductivity coated conductor lcsh:QH201-278.5 lcsh:T overlap joint high-temperature superconductor 021001 nanoscience & nanotechnology Microstructure lead-free solder lcsh:TA1-2040 lcsh:Descriptive and experimental mechanics lcsh:Electrical engineering. Electronics. Nuclear engineering soldered joint 0210 nano-technology lcsh:Engineering (General). Civil engineering (General) lcsh:TK1-9971 |
| Zdroj: | Materials Volume 14 Issue 4 Materials, Vol 14, Iss 1052, p 1052 (2021) |
| ISSN: | 1996-1944 |
| Popis: | We prepared overlap soldered joints of high-temperature superconducting tapes, using various materials and preparation conditions. In order to select the joints with optimal performance, we correlated their electrical properties (derived from current–voltage curves) with the microstructure of the respective joint cross-section by scanning electron microscopy. With the first group of joints, we focused on the effect of used materials on joint resistivity and critical current, and we found that the dominant role was played by the quality of the internal interfaces of the superconducting tape. Initial joint resistivities ranged in the first group from 41 to 341 nΩ·cm2. The second group of joints underwent a series of thermal cyclings, upon which the initial resistivity range of 35‒49 nΩ·cm2 broadened to 25‒128 nΩ·cm2. After the total of 135 thermal cycles, three out of four joints showed no signs of significant degradation. Within the limit of 100 thermal cycles, reliable soldered joints can be thus prepared, with normalized resistivity not exceeding 1.4 and with normalized critical current above the value of 0.85. |
| Databáze: | OpenAIRE |
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