Optimization of PCM based thermal management device for power electronics using an effective thermal conductivity model for architected enhancers
Autor: | Thomas Merlet, Edwin Hang Tong Teo, Dunlin Tan, Jerome Foncin, Hongling Li, Romain Hubert, Philippe Pernod, Philippe Coquet, Jong Jen Yu, Olivier Bou-Matar |
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Přispěvatelé: | Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 (IEMN), Centrale Lille-Université de Lille-Centre National de la Recherche Scientifique (CNRS)-Université Polytechnique Hauts-de-France (UPHF)-JUNIA (JUNIA), Acoustique Impulsionnelle & Magnéto-Acoustique Non linéaire - Fluides, Interfaces Liquides & Micro-Systèmes - IEMN (AIMAN-FILMS - IEMN), Centrale Lille-Université de Lille-Centre National de la Recherche Scientifique (CNRS)-Université Polytechnique Hauts-de-France (UPHF)-JUNIA (JUNIA)-Centrale Lille-Université de Lille-Centre National de la Recherche Scientifique (CNRS)-Université Polytechnique Hauts-de-France (UPHF)-JUNIA (JUNIA), CNRS International NTU THALES Research Alliance (UMI CINTRA), THALES-Nanyang Technological University [Singapour]-Centre National de la Recherche Scientifique (CNRS), CINTRA / SEEE Nanyang Technological University, Nanyang Technological University [Singapour], Thales Air Systems, Thales Group [France], Université catholique de Lille (UCL)-Université catholique de Lille (UCL), THALES [France], Université catholique de Lille (UCL)-Université catholique de Lille (UCL)-Centrale Lille-Université de Lille-Centre National de la Recherche Scientifique (CNRS)-Université Polytechnique Hauts-de-France (UPHF)-JUNIA (JUNIA), CNRS International - NTU - Thales Research Alliance (CINTRA), THALES [France]-Nanyang Technological University [Singapour]-Centre National de la Recherche Scientifique (CNRS), The authors would like to thank Djamila BAHLOUL-HOURLIER (IEMN, CNRS) for her help in the Differential Scanning Calorimetry measurements. |
Jazyk: | angličtina |
Rok vydání: | 2021 |
Předmět: |
melting
Materials science Enthalpy of fusion thermal energy storage Enclosure latent heat Conductivity Thermal energy storage 7. Clean energy Phase-change material [SPI]Engineering Sciences [physics] Thermal conductivity phase change materials thermal management (packaging) Latent heat Power electronics thermal conductivity Composite material |
Zdroj: | 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), Jun 2021, San Diego, United States. pp.452-459, ⟨10.1109/ITherm51669.2021.9503251⟩ |
DOI: | 10.1109/ITherm51669.2021.9503251⟩ |
Popis: | International audience; Phase Change Material (PCM) have been widely used for thermal energy storage due to their high latent heat of fusion. Several types of PCM are available and can be selected to meet the required melting temperature and latent heat value. However their low thermal conductivity drastically reduces their performances. Without thermal conductivity enhancement, melting would mainly occur at the interface between the heated surface and the PCM, and would slowly spread in the bulk of the PCM. In that sens the use of fillers is necessary. We present here a study on the use of metallic lattice structure as PCM enhancers. In this paper we illustrate the use of a Effective Thermal Conductivity (ETC) model for four different lattice structures to optimize a PCM based device for the thermal management of power electronics. The optimization is done in terms of device overall dimensions (especially its height) but also in term of composite (or enhanced PCM) enclosure. Actually the composite needs to be enclosed to avoid leaking but the enclosure also serves a heat spreading role which is studied here. |
Databáze: | OpenAIRE |
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