Effects of CMP slurry additives on the agglomeration of alumina nanoparticles 1: General aggregation rate behavior
| Autor: | Neil Brahma, Jan B. Talbot |
|---|---|
| Rok vydání: | 2014 |
| Předmět: |
Inorganic chemistry
Nanoparticle Surfaces Coatings and Films Electronic Optical and Magnetic Materials Suspension (chemistry) Biomaterials chemistry.chemical_compound Colloid and Surface Chemistry Isoelectric point chemistry Agglomerate Chemical-mechanical planarization Zeta potential Particle Sodium dodecyl sulfate |
| Zdroj: | Journal of Colloid and Interface Science. 419:56-60 |
| ISSN: | 0021-9797 |
| DOI: | 10.1016/j.jcis.2013.12.029 |
| Popis: | The aggregation behavior for 150 nm alumina particles suspended in 1 mM KNO3 solutions with various additives used in chemical mechanical planarization of copper was investigated. Three behaviors were observed: no aggregation, reversible aggregation where large agglomerates formed almost instantaneously, and steady aggregation where particle sizes grew over the duration of the measurement. In general steady aggregation occurred at high pH for all suspensions, while no aggregation occurred at acidic pH, except with suspensions with sodium dodecyl sulfate, where reversible aggregation was observed. No aggregation was observed at near neutral pH for all suspensions. Zeta potential and isoelectric points for each suspension were also measured. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|
Full Text from ScienceDirect