Wafer-Level Fabrication of Microcube-Typed Beam-Splitters by Saw-Dicing of Glass Substrate
| Autor: | Blandine Guichardaz, Etienne Herth, Maik Wiemer, Maciej Baranski, Sylwester Bargiel, Christophe Gorecki, Nicolas Passilly, C. Jia, Jörg Frömel |
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| Přispěvatelé: | Publica, Franche-Comté Électronique Mécanique, Thermique et Optique - Sciences et Technologies (UMR 6174) (FEMTO-ST), Université de Technologie de Belfort-Montbeliard (UTBM)-Ecole Nationale Supérieure de Mécanique et des Microtechniques (ENSMM)-Université de Franche-Comté (UFC), Université Bourgogne Franche-Comté [COMUE] (UBFC)-Université Bourgogne Franche-Comté [COMUE] (UBFC)-Centre National de la Recherche Scientifique (CNRS), Fraunhofer Institute for Electronic Nano Systems (Fraunhofer ENAS), Fraunhofer (Fraunhofer-Gesellschaft) |
| Rok vydání: | 2014 |
| Předmět: |
Materials science
Fabrication business.industry 02 engineering and technology Substrate (printing) 021001 nanoscience & nanotechnology 01 natural sciences Waveguide (optics) Atomic and Molecular Physics and Optics Electronic Optical and Magnetic Materials law.invention 010309 optics Reflection (mathematics) Optics law 0103 physical sciences Optoelectronics Wafer dicing Wafer [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics Electrical and Electronic Engineering 0210 nano-technology business Beam splitter Beam (structure) |
| Zdroj: | IEEE Photonics Technology Letters IEEE Photonics Technology Letters, Institute of Electrical and Electronics Engineers, 2014, 26, pp.100-103. ⟨10.1109/LPT.2013.2289981⟩ |
| ISSN: | 1941-0174 1041-1135 |
| DOI: | 10.1109/lpt.2013.2289981 |
| Popis: | International audience; This letter reports on the development of an integrated micro-optical beam splitter that can be array-arranged. The proposed wafer-level fabrication, based on 45° saw-dicing of glass substrates, allows rapid and low-cost processing. In particular, it leads to high compactness and possibility of wafer-level alignment/assembly, suitable for vertically integrated imaging micro-instruments. The device, including additional out-of plane reflection for extraction of sensing beam, can be as small as 1 mm3. |
| Databáze: | OpenAIRE |
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