Design, Materials, Process, and Fabrication of Fan-Out Panel-Level Heterogeneous Integration
| Autor: | Sze Pei Lim, Cheng-Ta Ko, Henry Yang, Tony Chen, Cao Xi, Eric Kuah, Zhang Li, Hsing-Hui Wu, Jeffery C. C. Lo, Yu-Hua Chen, Chieh-Lin Chang, Jhih-Yuan Pan, Kim Hwee Tan, John H. Lau, Mian Tao, Junfen Lin, Nelson Fan, Ning Cheng Lee, Iris Xu, Penny Lo, Marc Lin, Margie Li, Ming Li, Ricky Lee, Rozalia Beica, Chia-Hung Lin, Curry Lin |
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| Rok vydání: | 2018 |
| Předmět: |
010302 applied physics
Fabrication Materials science Computer Networks and Communications business.industry 020208 electrical & electronic engineering Fan-out Dielectric Epoxy 02 engineering and technology Photoresist Chip 01 natural sciences Electronic Optical and Magnetic Materials Conductor Printed circuit board visual_art 0103 physical sciences Automotive Engineering visual_art.visual_art_medium 0202 electrical engineering electronic engineering information engineering Optoelectronics Electrical and Electronic Engineering business |
| Zdroj: | International Symposium on Microelectronics. 2018:000057-000063 |
| ISSN: | 2380-4505 |
| DOI: | 10.4071/2380-4505-2018.1.000057 |
| Popis: | The design, materials, process, and fabrication of a heterogeneous integration of four chips by a fan-out panel-level packaging (FOPLP) method are investigated in this study. Emphasis is placed on (1) the application of a dry-film epoxy molding compound for molding the chips and (2) the application of a special assembly process called uni-substrate-integrated package for fabricating the redistribution layers (RDLs) of the FOPLP. The Ajinomoto build-up film is used as the dielectric of the RDLs and is built up by the semiadditive process. Electroless Cu is used to make the seed layer, laser direct imaging is used for opening the photoresist, and printed circuit board (PCB) Cu plating is used for making the conductor wiring of the RDLs. The panel dimensions are 508 × 508 mm. The package dimensions of the FOPLP are 10 × 10 mm. The large chip size and the small chip sizes are, respectively, 5 × 5 mm and 3 × 3 mm. The uniqueness of this study is that all the processes are carried out by using the PCB equipment. |
| Databáze: | OpenAIRE |
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