Test and Calibration of RF Circuits Using Built-in Non-intrusive Sensors
| Autor: | Haralampos-S. Stratigopoulos, Martin Andraud, Emmanuel Simeu, Athanasios Dimakos, Salvador Mir, Louay Abdallah |
|---|---|
| Přispěvatelé: | Techniques de l'Informatique et de la Microélectronique pour l'Architecture des systèmes intégrés (TIMA), Université Joseph Fourier - Grenoble 1 (UJF)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Centre National de la Recherche Scientifique (CNRS), Techniques of Informatics and Microelectronics for integrated systems Architecture (TIMA), Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP)-Centre National de la Recherche Scientifique (CNRS)-Université Grenoble Alpes (UGA), Torella, Lucie |
| Rok vydání: | 2015 |
| Předmět: |
Very-large-scale integration
Engineering business.industry [SPI.NANO] Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics 020208 electrical & electronic engineering Process (computing) Electrical engineering 02 engineering and technology RF probe 020202 computer hardware & architecture Test (assessment) PACS 85.42 0202 electrical engineering electronic engineering information engineering Electronic engineering Calibration System on a chip Radio frequency [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics business ComputingMilieux_MISCELLANEOUS Electronic circuit |
| Zdroj: | ISVLSI IEEE International Computer Society Annual Symposium on VLSI (ISVLSI'15) IEEE International Computer Society Annual Symposium on VLSI (ISVLSI'15), Jul 2015, Montpellier, France. pp.627 |
| Popis: | Testing the RF functions of mixed-signal Systems-on-Chip is responsible for a very large fraction of the overall test cost. In addition, RF circuits, when designed in the most advanced technologies (e.g. 65nm and beyond), typically require some calibration mechanisms so as to guarantee a high yield. Built-in test structures is a promising approach to facilitate test and calibration of RF circuits. However, tapping into RF signal paths may seriously degrade the performances and certainly necessitates co-designing the RF circuit together with the built-in test circuitry to meet the desired performance trade-off. This challenge finds the designers rather reluctant to adopt a built-in test approach. In this work, we develop a non-intrusive built-in test approach based on sensors that are totally transparent to the RF circuit. In particular, we show how performance deviations can be implicitly predicted by sensors that monitor process variations (e.g. Variation-aware sensors) and how defects can be detected by temperature sensors. In addition, we show that the variation-aware sensors can be used for calibrating the RF circuit in one-shot, that is, without requiring a test/calibration loop. |
| Databáze: | OpenAIRE |
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