| Autor: |
Sarah Zerbini, F. Cacchione, Alberto Corigliano |
| Rok vydání: |
2007 |
| Předmět: |
|
| Zdroj: |
Politecnico di Milano-IRIS |
| Popis: |
A parametric numerical study aimed at understanding the influence of the average grain size on the mechanical behaviour of polysilicon films was addressed in this paper. A 2D geometrical model of the polycrystal coupled with a finite element (FE) procedure was employed. To simulate inter-granular and trans-granular crack propagation a cohesive crack model was used. The results were finally analyzed using the Weibull weakest link approach. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
|
