Hot roll embossing in thermoplastic foils using dry-etched silicon stamp and multiple passes

Autor: Roland Salut, Khaled Metwally, Laurent Robert, Samuel Queste, Chantal Khan-Malek
Přispěvatelé: Franche-Comté Électronique Mécanique, Thermique et Optique - Sciences et Technologies (UMR 6174) (FEMTO-ST), Université de Technologie de Belfort-Montbeliard (UTBM)-Ecole Nationale Supérieure de Mécanique et des Microtechniques (ENSMM)-Centre National de la Recherche Scientifique (CNRS)-Université de Franche-Comté (UFC), Université Bourgogne Franche-Comté [COMUE] (UBFC)-Université Bourgogne Franche-Comté [COMUE] (UBFC), Université de Technologie de Belfort-Montbeliard (UTBM)-Ecole Nationale Supérieure de Mécanique et des Microtechniques (ENSMM)-Université de Franche-Comté (UFC), Université Bourgogne Franche-Comté [COMUE] (UBFC)-Université Bourgogne Franche-Comté [COMUE] (UBFC)-Centre National de la Recherche Scientifique (CNRS)
Rok vydání: 2011
Předmět:
0209 industrial biotechnology
Materials science
Silicon
chemistry.chemical_element
02 engineering and technology
[SPI.MAT]Engineering Sciences [physics]/Materials
law.invention
020901 industrial engineering & automation
Etching (microfabrication)
law
Deep reactive-ion etching
Wafer
[SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics
Electrical and Electronic Engineering
Reactive-ion etching
Composite material
[SPI.ACOU]Engineering Sciences [physics]/Acoustics [physics.class-ph]
[PHYS.PHYS.PHYS-OPTICS]Physics [physics]/Physics [physics]/Optics [physics.optics]
021001 nanoscience & nanotechnology
Condensed Matter Physics
Atomic and Molecular Physics
and Optics
Surfaces
Coatings and Films
Electronic
Optical and Magnetic Materials
chemistry
Dry etching
Photolithography
0210 nano-technology
Embossing
Zdroj: Microelectronic Engineering
Microelectronic Engineering, 2012, 88 (8), pp.2679-2682
Microelectronic Engineering, Elsevier, 2012, 88 (8), pp.2679-2682
Microelectronic Engineering, Elsevier, 2011, 88 (8), pp.2679-2682
ISSN: 0167-9317
1873-5568
DOI: 10.1016/j.mee.2011.02.009
Popis: International audience; Hot roll embossing is a promising technique for manufacturing and patterning of micron and sub-micron features. It attracted attention due to its high volume production and large area processing. In this work, we describe a hot-roll-embossing process for manufacturing flexible devices in different commercially available thermoplastic polymer foils using a microstructured silicon wafer as a flat stamping tool. Larger features of a 100 lm width were defined by photolithography and dry etching. A process combining deep reactive ion etching and reactive ion etching of silicon in fluorinated plasma was developed to achieve patterns in silicon with slightly positively tapered sidewalls to allow for easy demoulding. 100 l m fea- tures were successfully replicated in cyclic-olefin-copolymer (COC) and poly-methyl-methacrylate (PMMA), using relatively low temperature and multiple passes. Smaller features with 1 lm width were patterned by electron beam lithography and transferred by DRIE in silicon stamps, then replicated in COC foils.
Databáze: OpenAIRE
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