| Popis: |
In the fabrication of micro electrode arrays (MEAs) photolithographic methods common in semiconductor manufacturing are needed due to feature sizes down to a few microns. Due to wide availability, reasonable device costs and suitable performance, optical UV-lithography utilizing chrome masks is the most common patterning method [1]. The drawback of this method is, however, the need for a new set of relatively expensive masks for each new MEA design. Depending on the layers and fabrication processes used, several photolithographic steps and thus several masks might be needed for one MEA design, rising the mask costs per one MEA design to thousands of euro. Manufacturing and shipping of new masks cause also delays to MEA development process. To cut mask costs and time needed for prototyping or even commercial production of new MEA designs, we suggest a concept where the modified part of the design is patterned using maskless direct writing method. The concept and an economical self built digital exposure device [2] for direct writing are introduced in the following chapters. |
