| Autor: |
Hirofumi Hidai, Taro Sugita, Hitoshi Tokura |
| Rok vydání: |
2009 |
| Předmět: |
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| Zdroj: |
Advanced Materials Research. :440-444 |
| ISSN: |
1662-8985 |
| DOI: |
10.4028/www.scientific.net/amr.76-78.440 |
| Popis: |
Polycrystalline ingot slicing by wire electric discharge machining (W-EDM) has been investigated to reduce kerf loss and wafer thickness. In order to use the sliced wafers for semiconductor devices, the modified surface layer induced by W-EDM must be removed. In this paper, we have demonstrated the elimination of the layer by abrasive blasting. Three types of abrasives were blasted at a speed of 100 m/s. The surfaces blasted with WA #1000 and GC #1000 were smoother than that sliced with a wire saw. The modified layer induced by W-EDM slicing could be removed by blasting with WA #1000 while scanning the surface three times. Solar cells were fabricated using wafers with the blasted surface with an efficiency of 15.2%, which was almost the same as that of cells fabricated from the wire-sliced wafers. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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