Dissimilar joining of alumina to aluminum at room temperature without applying a loading by two-step deposition
| Autor: | Mamoru Mabuchi, Soichiro Deguchi, Koji Naito, Masataka Hakamada |
|---|---|
| Jazyk: | japonština |
| Rok vydání: | 2021 |
| Předmět: |
Work (thermodynamics)
Materials science Alumina chemistry.chemical_element 02 engineering and technology Substrate (electronics) 010402 general chemistry 01 natural sciences Thermal expansion Electrodeposition Etching (microfabrication) Aluminium Electroless deposition Deposition (phase transition) General Materials Science Composite material Porosity Mechanical Engineering Joining 021001 nanoscience & nanotechnology Condensed Matter Physics 0104 chemical sciences chemistry Mechanics of Materials Fracture (geology) 0210 nano-technology Aluminum |
| Zdroj: | Materials Letters. 286 |
| ISSN: | 0167-577X |
| Popis: | Low temperature joining is desirable for aluminum-ceramics joining because aluminum has a large coefficient of thermal expansion. In the present work, joining of Al2O3 to Al was performed at room temperature by the two-step deposition method including Ni electroless deposition and Cu electrodeposition. The joining strength was increased, and the fracture mode changed from a fracture at the Ni/Al2O3 interface to that in the Al2O3 substrate by using a porous Al2O3 or by etching a dense Al2O3 surface. Thus, the present work demonstrates that Al2O3 and Al are successfully joined at room temperature without applying a load by the deposition method. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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