Scalable Microfabrication Procedures for Adhesive-Integrated Flexible and Stretchable Electronic Sensors
| Autor: | Gladys Ornelas, Dae Y. Kang, Todd P. Coleman, Mridu Sinha, Yun-Soung Kim, Keerthiga Naidu |
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| Jazyk: | angličtina |
| Rok vydání: | 2015 |
| Předmět: |
Fabrication
Computer science Environmental Science and Management Nanotechnology 02 engineering and technology Biosensing Techniques 010402 general chemistry lcsh:Chemical technology 01 natural sciences Biochemistry flexible electronics Article Roll-to-roll processing Analytical Chemistry chemistry.chemical_compound Adhesives Electronic engineering Microtechnology lcsh:TP1-1185 Electronics Electrical and Electronic Engineering Pliability Instrumentation Polydimethylsiloxane Ecology flexible sensors Adhesion Equipment Design 021001 nanoscience & nanotechnology peel-off Atomic and Molecular Physics and Optics Flexible electronics Elasticity 0104 chemical sciences chemistry Scalability Adhesive Glass roll-to-roll 0210 nano-technology Distributed Computing Microfabrication |
| Zdroj: | Sensors (Basel, Switzerland) Sensors (Basel, Switzerland), vol 15, iss 9 Sensors, Vol 15, Iss 9, Pp 23459-23476 (2015) Sensors Volume 15 Issue 9 Pages 23459-23476 |
| ISSN: | 1424-8220 |
| Popis: | New classes of ultrathin flexible and stretchable devices have changed the way modern electronics are designed to interact with their target systems. Though more and more novel technologies surface and steer the way we think about future electronics, there exists an unmet need in regards to optimizing the fabrication procedures for these devices so that large-scale industrial translation is realistic. This article presents an unconventional approach for facile microfabrication and processing of adhesive-peeled (AP) flexible sensors. By assembling AP sensors on a weakly-adhering substrate in an inverted fashion, we demonstrate a procedure with 50% reduced end-to-end processing time that achieves greater levels of fabrication yield. The methodology is used to demonstrate the fabrication of electrical and mechanical flexible and stretchable AP sensors that are peeled-off their carrier substrates by consumer adhesives. In using this approach, we outline the manner by which adhesion is maintained and buckling is reduced for gold film processing on polydimethylsiloxane substrates. In addition, we demonstrate the compatibility of our methodology with large-scale post-processing using a roll-to-roll approach. |
| Databáze: | OpenAIRE |
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