Slurry Injection Schemes on the Extent of Slurry Mixing and Availability during Chemical Mechanical Planarization
| Autor: | Ruochen Han, Matthew Bahr, Yasa Sampurno, Ara Philipossian |
|---|---|
| Rok vydání: | 2017 |
| Předmět: |
Radial position
Materials science lcsh:Mechanical engineering and machinery slurry availability slurry injection system slurry injection position chemical mechanical planarization CMP slurry utilization efficiency Mixing (process engineering) Polishing Fraction (chemistry) 02 engineering and technology 01 natural sciences Article Chemical-mechanical planarization 0103 physical sciences lcsh:TJ1-1570 Wafer Electrical and Electronic Engineering 010302 applied physics Waste management Mechanical Engineering Metallurgy 021001 nanoscience & nanotechnology Control and Systems Engineering Slurry 0210 nano-technology |
| Zdroj: | Micromachines; Volume 8; Issue 6; Pages: 170 Micromachines, Vol 8, Iss 6, p 170 (2017) Micromachines |
| ISSN: | 2072-666X |
| Popis: | In this study, slurry availability and the extent of the slurry mixing (i.e., among fresh slurry, spent slurry, and residual rinse-water) were varied via three different injection schemes. An ultraviolet enhanced fluorescence technique was employed to qualitatively indicate slurry availability and its flow on the pad during polishing. This study investigated standard pad center area slurry application and a slurry injection system (SIS) that covered only the outer half of the wafer track. Results indicated that the radial position of slurry injection and the alteration of fluid mechanics by the SIS played important roles in slurry mixing characteristics and availability atop the pad. Removal rates were found to decrease with slurry availability, while a higher degree of slurry mixing decreased the fraction of fresh slurry and consequently lowered the removal rate. By using a hybrid system (i.e., a combination of slurry injection via SIS and standard pad center slurry application), the polishing process benefited from higher slurry availability and higher fraction of fresh slurry than the conventional pad center slurry application and the shorter SIS, individually. This work underscores the importance of optimum slurry injection geometry and flow for obtaining a more cost-effective and environmentally benign chemical mechanical planarization process. |
| Databáze: | OpenAIRE |
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