Solder fatigue failures in a new designed power module under Power Cycling
| Autor: | Markus Klingler, C. Durand, Daniel Coutellier, Maxence Bigerelle |
|---|---|
| Přispěvatelé: | Robert Bosch GmbH, Robert Bosch Campus 1, D-71272 Renningen, Germany, Laboratoire d'Automatique, de Mécanique et d'Informatique industrielles et Humaines - UMR 8201 (LAMIH), Université de Valenciennes et du Hainaut-Cambrésis (UVHC)-Centre National de la Recherche Scientifique (CNRS)-INSA Institut National des Sciences Appliquées Hauts-de-France (INSA Hauts-De-France), ENSIAME, Université de Valenciennes et du Hainaut-Cambrésis (UVHC) |
| Jazyk: | angličtina |
| Rok vydání: | 2016 |
| Předmět: |
Wire bonding
Materials science Mechanical engineering 02 engineering and technology Robustness (computer science) 0202 electrical engineering electronic engineering information engineering Electronic engineering Electrical and Electronic Engineering Safety Risk Reliability and Quality 020208 electrical & electronic engineering [SPI.MECA]Engineering Sciences [physics]/Mechanics [physics.med-ph] 021001 nanoscience & nanotechnology Condensed Matter Physics Atomic and Molecular Physics and Optics Finite element method Surfaces Coatings and Films Electronic Optical and Magnetic Materials Creep Power module Soldering Power cycling 0210 nano-technology |
| Zdroj: | Microelectronics Reliability Microelectronics Reliability, Elsevier, 2016, 66, pp.122-133. ⟨10.1016/j.microrel.2016.10.002⟩ |
| ISSN: | 0026-2714 |
| DOI: | 10.1016/j.microrel.2016.10.002⟩ |
| Popis: | IF=1.2; International audience; Today a point has been reached where lifetimes of power modules are limited by the standard packaging technologies, such as wire bonding. To surpass these limits, a new power module was designed using Cu clips as interconnects instead of Al wire bonds. With this new design the structure robustness should be improved and lead to a reliability gain but in counterpart it requires an additional solder layer in order to fix the clip onto the die. This paper studies the failure mechanisms occurring in these two solder layers under power cycling. The behavior of solder layers is precisely analyzed by performing power cycling tests and by taking advantage of Finite Elements simulations. Furthermore an experimental and numerical sensitivity study on test parameters is conducted. Results obtained enable the definition of solder lifetime prediction models. |
| Databáze: | OpenAIRE |
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