Adhesion of polyimides to alumina without coupling agents
| Autor: | P.D. Murphy, C.W. Chu |
|---|---|
| Rok vydání: | 1992 |
| Předmět: |
Materials science
Interfacial adhesion Surfaces and Interfaces General Chemistry Hydrothermal circulation Surfaces Coatings and Films Catalysis chemistry.chemical_compound chemistry Mechanics of Materials Polymer chemistry Materials Chemistry Amine gas treating Benzene Imide Curing (chemistry) Polyimide |
| Zdroj: | Journal of Adhesion Science and Technology. 6:1119-1135 |
| ISSN: | 1568-5616 0169-4243 |
| Popis: | Surface experiments offer persuasive evidence for an imide-carbonyl-to-surface-hydroxyl bonding phenomenon as a likely source of the 'natural' interfacial adhesion of polyimide on a mineral surface which develops after high-temperature curing. Nitrogen-15 (N-15) solid-state NMR techniques are used to study the interface between high-surface-area alumina and polyimides PMDA-ODA (pyromelliticdianhydride-4-4'-oxydianiline, meta-ethylester precursor) and BTDA-APB-APA [benzephenonetetracarboxyldianhydride-1,3-di(3-aminophenoxy)benzene with 3-amino-phenylacetylene endcaps, isoimide precursor]. Polyimide film thickness is estimated to be 30-150 A. The polyimide/alumina interface shows catalytic activity at temperatures from 150-255°C which results in amine production and implies PI (polyimide) backbone (chain) cleavage. However, this phenomenon does not appear to be related to the 'natural' adhesion which occurs above 300°C. At 400°C, a perturbation to about 12% of the imide groups is detected by N-15 NMR. A lik... |
| Databáze: | OpenAIRE |
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