Ultra-thin Image Sensor Chip Embeded Foil

Autor:	S. Wang, B. Albrecht, Christine Harendt, Joachim N. Burghartz, J. D. Schulze Spuntrup
Rok vydání:	2021
Předmět:	Materials science business.industry ComputingMethodologies_IMAGEPROCESSINGANDCOMPUTERVISION Chip Flexible electronics Microcontroller Hybrid system Chemical-mechanical planarization visual_art Electronic component visual_art.visual_art_medium Optoelectronics Image sensor business FOIL method
Zdroj:	2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS).
DOI:	10.1109/fleps51544.2021.9469747
Popis:	Hybrid Systems in Foil (HySiF) is an integration concept for high-performance and large-area flexible electronics. The technology allows for integrating ultra-thin chips and widely distributed electronic components, such as sensors, microcontrollers or antennas, in thin flexible polymer film, using CMOS-compatible equipment and processing. This paper focuses on the embedding and characterization of a bendable ultra-thin image sensor in flexible polymer foil.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::fcee63d40b09cc485c2c066afb7e004a https://doi.org/10.1109/fleps51544.2021.9469747 Zobrazit plný text záznamu