Failure analysis on 14 nm FinFET devices with ESD CDM failure
| Autor: | Zhihong Mai, Pik Kee Tan, Hao Tan, Y.Z. Ma, Yuzhe Zhao, Yanlin Pan, C. Shaalini, Alfred Quah, Bo Liu |
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| Rok vydání: | 2018 |
| Předmět: |
010302 applied physics
Materials science Electrostatic discharge Circuit design 020208 electrical & electronic engineering Transistor 02 engineering and technology Condensed Matter Physics 01 natural sciences Engineering physics Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials law.invention law 0103 physical sciences Charged-device model 0202 electrical engineering electronic engineering information engineering Technology scaling Node (circuits) Electrical and Electronic Engineering Safety Risk Reliability and Quality Metal gate Front end of line |
| Zdroj: | Microelectronics Reliability. :321-333 |
| ISSN: | 0026-2714 |
| DOI: | 10.1016/j.microrel.2018.06.105 |
| Popis: | Electrostatic Discharge (ESD) is an important area for the semiconductor industry because ESD has an impact on production yield and product quality. ESD problems are increasing and have become challenging in the semiconductor industry because of the trends toward higher speed and shrinking in technology node. By continually shrinking the transistor with technology scaling, the process, circuit design, and failure analysis (FA) are getting more challenging. This paper is about FA on a 14 nm Fin-Field Effect Transistor (FinFET) device which has ESD failure after Charged Device Model (CDM) test. In most ESD failure FA, most of the time found Electrical Over Stress (EOS), the important is to understand which process layer or design causing the EOS. At the same time, this paper also discusses the difficulties faced, the FA technique used, the bottleneck of the 14 nm FinFET FA by old technology node FA equipment, and the FA findings. Finally, the ESD failure was identified with Scanning Transmission Electron Microscope (STEM)/Energy Dispersive Spectroscopy (EDS) analysis. The FA findings of the failure are related to the front end of line (FEOL), the metal gate of FinFET was fused with active, and the material in the metal gate was out-diffused. |
| Databáze: | OpenAIRE |
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