Enhanced electronic system reliability - challenges for temperature prediction

Autor:	John Parry, Jukka Rantala, Clemens J. M. Lasance
Rok vydání:	2002
Předmět:	Engineering Telecommunication network reliability business.industry Emerging technologies Systems engineering Context (language use) Electronics Electrical and Electronic Engineering business Electronic systems Reliability (statistics) Electronic Optical and Magnetic Materials
Zdroj:	IEEE Transactions on Components and Packaging Technologies. 25:533-538
ISSN:	1521-3331
DOI:	10.1109/tcapt.2002.808001
Popis:	Using telecommunication as an example, it is argued that the electronics industry badly needs a change in attitude toward reliability thinking. The role of thermal design and reliability qualification is discussed in context of current industrial needs for short design cycles and rapid implementation of new technologies. Current and future practices are discussed in the context of newly-emerging reliability standards. Finally, two multi-company projects targeting the improvement of reliability through better temperature-related information are described.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::fa6bb68fb7b000d671cbb86b247fb621 https://doi.org/10.1109/tcapt.2002.808001 Zobrazit plný text záznamu