Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates. II: Fracture Mechanism Map

Autor: Praveen Kumar, Ravi Mahajan, Rajen S. Sidhu, M. Renavikar, Indranath Dutta, Z. Huang
Rok vydání: 2011
Předmět:
Zdroj: Journal of Electronic Materials. 41:412-424
ISSN: 1543-186X
0361-5235
DOI: 10.1007/s11664-011-1806-7
Popis: A methodology to construct fracture mechanism maps for Sn-3.8%Ag-0.7%Cu (SAC387) solder joints attached to Cu substrates has been developed. The map, which delineates the operative mechanisms of fracture along with corresponding joint fracture toughness values, is plotted in a space described by two microstructure-dependent parameters, with the abscissa describing the interfacial intermetallic compound (IMC) and the ordinate representing the strain-rate-dependent solder yield strength. The plot space encompasses the three major mechanisms by which joints fail, namely (i) cohesive fracture of solder, (ii) cleavage fracture of interfacial intermetallic compounds (IMC), and (iii) fracture of the solder–IMC interface. Line contours of constant fracture toughness values, as well as constant fraction of each of the above mechanisms, are indicated on the plots. The plots are generated by experimentally quantifying the dependence of the operative fracture mechanism(s) on the two microstructure-dependent parameters (IMC geometry and solder yield strength) as functions of strain rate, reflow parameters, and post-reflow aging. Separate maps are presented for nominally mode I and equi-mixed mode loading conditions (loading angle ϕ = 0° and 45°, respectively). The maps allow rapid assessment of the operative fracture mechanism(s) along with estimation of the expected joint fracture toughness value for a given loading condition (strain rate and loading angle) and joint microstructure without conducting actual tests, and may serve as a tool for both prediction and microstructure design.
Databáze: OpenAIRE
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