Autor: |
Thuy Mai, Robert Pryor, Jeffrey S. Meth, Stephen Zane, Holly Salerno, Michael T. Demko |
Rok vydání: |
2016 |
Předmět: |
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Zdroj: |
2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM). |
DOI: |
10.1109/semi-therm.2016.7458452 |
Popis: |
High through-plane thermal conductivity in composites can be achieved when high thermal conductivity filler is aligned in a polymer matrix such that the fibers traverse across the thickness of the sample. Here we report on the properties of a material with 38 volume% loading of pitch-based carbon fibers embedded in an epoxy with a sub-room temperature glass transition. By using multiple characterization techniques, we have determined the through-plane thermal conductivity to be 71 W/m-K. Even with such high loading of C-fibers, the Shore hardness of the sample remained relatively low. These elastic composites may find use as gap fillers for high power electronic components. |
Databáze: |
OpenAIRE |
Externí odkaz: |
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