Development of Novel Low-Temperature Curable Positive-Tone Photosensitive Dielectric Materials with High Elongation

Autor:	Yu Shoji, Yuki Masuda, Ryoji Okuda, Yutaro Koyama, Kimio Isobe, Hashimoto Keika
Rok vydání:	2016
Předmět:	010302 applied physics Adhesion promoters Chemical resistance Materials science 02 engineering and technology Adhesion Dielectric 021001 nanoscience & nanotechnology 01 natural sciences 0103 physical sciences Adhesive Elongation Composite material 0210 nano-technology
Zdroj:	2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
DOI:	10.1109/ectc.2016.149
Popis:	Novel Low-temperature curable positive-tone photosensitive polyimides (posi-PSPIs) with high elongationhave been developed as dielectric layers for copperredistribution layers (RDLs). The posi-PSPIs show lowtemperature curable nature, strong adhesion to the copper RDLs and high chemical resistance for establishing multi RDLs by incorporating polyimides with cross-linkers and adhesion promoters. Also, posi-PSPIs are able to achieve the high elongation property by improving the base-polyimides, therefore, the posi-PSPIs' high reliability in packages have been demonstrated as the next generation materials for RDLs.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::f371194ab336b68702a0e79d41ab5641 https://doi.org/10.1109/ectc.2016.149 Zobrazit plný text záznamu