Development of Die-embedded Micro-sensing System

Autor:	Junichi Koyama, Ming Yang
Rok vydání:	2010
Předmět:	Mechanics of Materials Computer science business.industry Mechanical Engineering Embedded system General Materials Science business Sensing system Die (integrated circuit)
Zdroj:	Journal of the Japan Society for Technology of Plasticity. 51:898-902
ISSN:	1882-0166 0038-1586
DOI:	10.9773/sosei.51.898
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::f06dccd4b8d812a6f64704f55d5fc3a2 https://doi.org/10.9773/sosei.51.898 Zobrazit plný text záznamu