| Autor: |
Michio Horiuchi, Yuuichi Matsuda, Yasue Tokutake, Tsuyoshi Kobayashi, Ryo Fukasawa |
| Rok vydání: |
2013 |
| Předmět: |
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| Zdroj: |
2013 IEEE 63rd Electronic Components and Technology Conference. |
| DOI: |
10.1109/ectc.2013.6575687 |
| Popis: |
To realize high density 3D packaging, various types of interposer including through vias are developed. Although the interposer should have a high wiring density not only horizontally but also vertically, the ability of the conventional interposers to provide high density through vias with a low cost is still quite limited. Copper-filled anodic aluminum oxide has been studied as an alternative interposer material. Stable electrical connection was confirmed with four-wiring-layer substrates. High density vias as fine as 35 μm pitch were realized as a ground-surrounded structure. This coaxial-like via structure was remarkably effective for reducing harmful noise that tends to increase with the increased via density required for high performance systems. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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