Optimization for Solder Joint Structure of Insulator Welding Through PCB

Autor:	Yangyang Li, Mingqi Gao, Dongyang Lei, Zeliang Wu, Yanming Zhang, Yuhua Pan
Rok vydání:	2022
Zdroj:	2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::edb8f826aa731483cec8540a28f2927f https://doi.org/10.1109/icept56209.2022.9873386 Zobrazit plný text záznamu