Comprehensive Study on Thermal Aging and Ball Shear Characterization of SAC-X Solders

Autor:	Norhanani Binte Jaafar, Chong Ser Choong, Sharon Lim Pei Siang, Chai Tai Chong
Rok vydání:	2021
Zdroj:	2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
DOI:	10.1109/eptc53413.2021.9663939
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::eac1b73f080394ec9a1e5676e9d8e55e https://doi.org/10.1109/eptc53413.2021.9663939 Zobrazit plný text záznamu