FOPOP Warpage Analysis for Package Design Optimization

Autor:	Ken Zhang, Vito Lin, Teny Shih, Andrew Kang, YuPo Wang
Rok vydání:	2023
Zdroj:	2023 International Conference on Electronics Packaging (ICEP).
DOI:	10.23919/icep58572.2023.10129706
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::eaaa7c6ccee0d158d58c5cea07387d24 https://doi.org/10.23919/icep58572.2023.10129706 Zobrazit plný text záznamu