Plating impacts on transmission characteristics of high-speed interface connectors

Autor:	Taegyu Bae, Jong-Gwan Yook, Tae-Wan Koo, Myung-Hyun Park
Rok vydání:	2015
Předmět:	Cable gland Materials science Transmission (telecommunications) Electromagnetic field solver Interface (computing) Plating Electrical connector Metallurgy Mechanical engineering Electrical conductor Signal
Zdroj:	2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).
Popis:	Plating on conductive compositions of an electrical connector for high-speed digital interfaces is generally implemented into production process to satisfy some mechanical or chemical reasons. In this paper, pins of connector are plated by various ways, and their impacts on performance of signal are investigated by three dimensional electromagnetic field solver. In addition, some alternatives for conventional plating are presented.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::e89c1f2ca769776dbc71449facbb30e5 https://doi.org/10.1109/edaps.2015.7383707 Zobrazit plný text záznamu