Effect of Sintering Temperature for Die-shear Strength of Non-pressure Sintering Copper Paste on Metal Plating
| Autor: | Dai Ishikawa, Thomas Blank, Helge Wurst, Felix Steiner, Hideo Nakako |
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| Rok vydání: | 2022 |
| Zdroj: | 2022 International Conference on Electronics Packaging (ICEP). |
| Databáze: | OpenAIRE |
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