| Autor: |
Hsing Ning Liu, Puru Bruce Lin, Winnie Lu, Tzvy-Jang Tseng, Curry Lin, Leo Chang, Yan-Jun Fan, John H. Lau, Cheng-Ta Ko, Eagle Lin, David Cheng, Tim Xia, Kai-Ming Yang, Chia-Yu Peng |
| Rok vydání: |
2021 |
| Předmět: |
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| Zdroj: |
2021 IEEE 71st Electronic Components and Technology Conference (ECTC). |
| DOI: |
10.1109/ectc32696.2021.00148 |
| Popis: |
In this study, the reliability of the solder joints of a 6-side molded panel-level chip-scale package (PLCSP) is investigated. Emphasis is placed on the thermal cycling test ( $-55^{\circ}\mathrm{C}\leftrightarrows 125^{\circ}\mathrm{C}$ , 50-minute cycle) of the 6-side molded PLCSP on a PCB (printed circuit board). For comparison purpose, the one without 6-side molded (ordinary) PLCSP is also subjected to the same test. The thermal cycling test results are plotted into a Weibull distribution and the true Weibull slope and true characteristic life at 90% confidence are presented. The solder joint mean life ratio of these two cases and its confidence level are also determined. Furthermore, their solder joint failure location and failure mode are provided. Finally, a non-linear, time and temperature dependent 3D finite element simulation is performed for these two cases and correlated with the thermal cycling test results. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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