Semiconductor Package Modeling at JEITA and Extension to IEC Standard

Autor:	Yutaka Kumano, Takuya Shinoda, Koji Nishi, Ken Miyazaki
Rok vydání:	2021
Předmět:	Computer science Semiconductor package Extension (predicate logic) Electrical and Electronic Engineering Iec standards Reliability engineering
Zdroj:	Journal of The Japan Institute of Electronics Packaging. 24:188-192
ISSN:	1884-121X 1343-9677
DOI:	10.5104/jiep.24.188
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::e123d07f2a70f67c65c9929ff1be1cc7 https://doi.org/10.5104/jiep.24.188 Zobrazit plný text záznamu