Investigate the heat conduction between film and substrate during sputtering process by multi-layer structure NiCr/NiSi film thermocouples

Autor: Zhihui Liu, Qizhen Wang, Xin Zhang, Bo Xing, Yumeng Yang, Hualin Wang, Weiwei Jiang, Yunxian Cui, Wanyu Ding
Rok vydání: 2023
Předmět:
Zdroj: Journal of Alloys and Compounds. 941:169020
ISSN: 0925-8388
DOI: 10.1016/j.jallcom.2023.169020
Databáze: OpenAIRE