Investigate the heat conduction between film and substrate during sputtering process by multi-layer structure NiCr/NiSi film thermocouples
Autor: | Zhihui Liu, Qizhen Wang, Xin Zhang, Bo Xing, Yumeng Yang, Hualin Wang, Weiwei Jiang, Yunxian Cui, Wanyu Ding |
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Rok vydání: | 2023 |
Předmět: | |
Zdroj: | Journal of Alloys and Compounds. 941:169020 |
ISSN: | 0925-8388 |
DOI: | 10.1016/j.jallcom.2023.169020 |
Databáze: | OpenAIRE |
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