| Autor: |
Yeong-Lin Lai, Wen Jung Chiang |
| Rok vydání: |
2015 |
| Předmět: |
|
| Zdroj: |
Key Engineering Materials. 661:121-127 |
| ISSN: |
1662-9795 |
| Popis: |
The system in a package (SiP) including of a system on a chip (SoC) and a double-data-rate-three synchronous dynamic random access memory (DDR3 SDRAM) were studied with respect to the high-speed characteristics. The SiP was the multi-chip-module thin-profile fine-pitch ball grid array (MCM TFBGA) package with four-layer substrate. The high-speed 1600-Mbps data rate DDR3 signals were used in the signal integrity (SI) analysis. The SiP with low-cost silver (Ag) wires displayed a 500.18-ps aperture width in the eye diagram, which was successfully achieved signal integrity (SI) performance requirement. This work demonstrated the SiP with the Ag wires was the great potential solution for the advanced high-speed product applications. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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