Pixel Pitch Hybrid Bonding and Three Layer Stacking Technology for BSI Image Sensor

Autor:	K. Tanida, S. Suzuki, T. Seo, M. Morinaga, H. Korogi, M. Tetani, M. Hamada, R. Eto, T. Yamashita, Y. Kato, N. Sato, T. Shimizu, T. Hanawa, H. Kubo, K. Ueda, F. Ito, Y. Noguchi, M. Nakamura, R. Mizukoshi, M. Takeuchi, M. Suzuki, N. Niisoe, I. Miyanaga, A. Ikeda, S. Matsumoto
Rok vydání:	2022
Zdroj:	2022 IEEE International Interconnect Technology Conference (IITC).
DOI:	10.1109/iitc52079.2022.9881305
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::dad9bb264289ad723efc81d29e810839 https://doi.org/10.1109/iitc52079.2022.9881305 Zobrazit plný text záznamu