3-D electromagnetic finite element analysis as an integral part of the board design process
| Autor: | J.F. DeFord, P. Wallen, J.R. Brauer |
|---|---|
| Rok vydání: | 2002 |
| Předmět: |
Engineering
Linear element business.industry Finite element limit analysis Mathematical analysis Hardware_PERFORMANCEANDRELIABILITY Mixed finite element method Integral equation Finite element method Inductance Computer Science::Hardware Architecture Hardware_INTEGRATEDCIRCUITS Scattering parameters Electronic engineering business Computer Science::Databases Extended finite element method |
| Zdroj: | Wescon/96. |
| DOI: | 10.1109/wescon.1996.554010 |
| Popis: | Behavior of signals in circuit boards can be predicted using three dimensional electromagnetic finite element analysis. For intermediate frequencies and clock rates, capacitance and inductance matrices can be computed by 3-D finite elements and used in circuit models to calculate transient signal waveforms. For higher frequencies, S-parameters must be used, and they can be computed using full wave 3-D finite element analysis. Both circuit parameters and S-parameters of typical circuit boards are computed using finite element analysis. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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