A method of thermal testing of microsystems
| Autor: | Andrzej Kos, Piotr Bratek |
|---|---|
| Rok vydání: | 2001 |
| Předmět: |
Very-large-scale integration
business.industry Computer science Electrical engineering Hardware_PERFORMANCEANDRELIABILITY Condensed Matter Physics Chip Temperature measurement Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials Microsystem Thermal Hardware_INTEGRATEDCIRCUITS Electronic engineering Electrical and Electronic Engineering Safety Risk Reliability and Quality business |
| Zdroj: | Microelectronics Reliability. 41:1877-1887 |
| ISSN: | 0026-2714 |
| Popis: | The paper presents a method of VLSI circuits testing using thermal phenomenon. The method is based on an original algorithm of placing temperature sensors on the chip surface and analysing temperature measurement results. The method enables both failure detection and location. Examples and results of analyses are presented. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|
Full Text from ScienceDirect