Multichip packaging technology with laser-patterned interconnects
| Autor: | Andrew T. Barfknecht, Bruce M. McWilliams, James L. Kaschmitter, David B. Tuckerman |
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| Rok vydání: | 1989 |
| Předmět: |
Interconnection
Materials science Packaging engineering business.industry Thermal resistance Laser beam machining General Engineering Integrated circuit Industrial and Manufacturing Engineering Electronic Optical and Magnetic Materials law.invention law Soldering Hardware_INTEGRATEDCIRCUITS Electronic engineering Optoelectronics Electrical and Electronic Engineering Tape-automated bonding business Electronic circuit |
| Zdroj: | IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 12:646-649 |
| ISSN: | 0148-6411 |
| Popis: | A multichip silicon-on-silicon packaging technology has been developed which incorporates laser-patterned thin-film interconnects. This technology is particularly suited for application in high-speed, high-power, and high-I/O systems, where its unique characteristics provide many advantages over more traditional methods. The laser-patterned thin-film interconnects allow higher I/O densities and better electrical performance than wire bonds or TAB (tape automated bonding). The face-up, thin-film eutectic die attach technique used provides much lower thermal resistance between the substrate and the chips than can be achieved with solder bump die attach. In addition, laser-patterned interconnects demonstrate superior ruggedness and fatigue resistance under thermomechanical cycling and shock. This technology has been used to produce a ten-chip memory module, samples of which have been subjected to testing by means of relevant methods of MIL-STD 883C. > |
| Databáze: | OpenAIRE |
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