Electromigration induced spontaneous Ag whisker growth in fine Ag-alloy bonding interconnects: Novel polarity effect
| Autor: | Hsiao-Min Chang, Fan-Yi Ouyang, Tzu-Yu Hsu, Jing-Yao Chang |
|---|---|
| Rok vydání: | 2016 |
| Předmět: |
010302 applied physics
Materials science Polarity (physics) Mechanical Engineering Metallurgy Current crowding Nucleation 02 engineering and technology Electron 021001 nanoscience & nanotechnology Condensed Matter Physics 01 natural sciences Electromigration Creep Mechanics of Materials Whisker 0103 physical sciences General Materials Science Composite material 0210 nano-technology Diode |
| Zdroj: | Materials Letters. 182:55-58 |
| ISSN: | 0167-577X |
| Popis: | Ag-alloy wire has been recognized to be a good candidate for interconnect in light-emitting diode (LED) technology. This study employed fine Ag-alloy wires bonded on Al-Si pad to investigate their failure mechanism under current stressing of 8×104 A/cm2 at ambient temperature of 150 °C and 175 °C, respectively. We report a novel polarity effect that the spontaneous whisker growth of Ag near bonded area only happens when electrons flowed from Al to Ag, while surface of bond joints remains intact with electrons flowed from Ag to Al, suggesting that the nucleation and growth of Ag whisker is strongly affected by the direction of electron flow. We proposed that the different behaviors on the whisker growth is because compressive stress caused by current crowding effect only builds up with electrons flowed from Al to Ag. |
| Databáze: | OpenAIRE |
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