A thermodynamic study of voiding phenomena in Cu–Cu thermo-compression wafer bonding
| Autor: | Martin Panholzer, J. Svoboda, Bernhard Rebhan |
|---|---|
| Rok vydání: | 2017 |
| Předmět: |
010302 applied physics
Void (astronomy) Materials science Wafer bonding Annealing (metallurgy) 02 engineering and technology 021001 nanoscience & nanotechnology Condensed Matter Physics 01 natural sciences Electronic Optical and Magnetic Materials Hardware and Architecture 0103 physical sciences Forensic engineering Electrical and Electronic Engineering Composite material 0210 nano-technology |
| Zdroj: | Microsystem Technologies. 24:815-822 |
| ISSN: | 1432-1858 0946-7076 |
| DOI: | 10.1007/s00542-017-3523-5 |
| Popis: | The influence of wafer bonding and post-bond annealing conditions on the (cavity) void size and distribution was investigated theoretically and verified experimentally. Based on Cu–Cu thermo-compression bonding at 175 °C for 30 min and subsequent annealing at 200 °C for 1, 6 and 24 h, respectively, in both cases the total void surface reduces with the duration of the heat treatment, showing good correlation between theory and experiment. However, the experimental results revealed that the average void size increases while voids number decreases, which is a deviation from the prediction of the physical model. |
| Databáze: | OpenAIRE |
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