Simulation and Experimental Validations of EM/TM/SM Physical Reliability for Interconnects Utilized in Stretchable and Foldable Electronics
| Autor: | Chang-Chun Lee, Oscar Chuang, Wei-Yuan Cheng, Steve Chiu, Chia-Ping Hsieh |
|---|---|
| Rok vydání: | 2019 |
| Předmět: |
Materials science
Fine pitch Mechanical engineering 020206 networking & telecommunications 02 engineering and technology Experimental validation 021001 nanoscience & nanotechnology Electromigration Stress (mechanics) Reliability (semiconductor) 0202 electrical engineering electronic engineering information engineering Redistribution layer Wafer Electronics 0210 nano-technology |
| Zdroj: | 2019 IEEE 69th Electronic Components and Technology Conference (ECTC). |
| DOI: | 10.1109/ectc.2019.00308 |
| Popis: | There are many portable electronic products made by fan-out wafer/panel level package (FOWLP/FOPLP). The redistribution layer(RDL) design with fine pitch to connect inter each application is used. However, the above packaging products usually face the issue of electromigration (EM). Hence, a finite-element-based simulation method to predict the EM/ thermomigration (TM)/ stressmigration (SM) physical reliability and experimental validation are proposed. In this research, the EM simulation method also considers other physical behaviors including stress and temperature effects for future applications such as stretchable and foldable electric products. |
| Databáze: | OpenAIRE |
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