Reliability Characterization of HBM featuring $\text{HK}+\text{MG}$ Logic Chip with Multi-stacked DRAMs
| Autor: | Sungmock Ha, S. Lee, GH. Bae, DS. Lee, S.H. Kim, BW. Woo, N-H Lee, YS. Lee, S. Pae |
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| Rok vydání: | 2023 |
| Zdroj: | 2023 IEEE International Reliability Physics Symposium (IRPS). |
| Databáze: | OpenAIRE |
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