| Autor: |
Patricia Gabella, Michael J. Satterfield, John R. Alvis |
| Rok vydání: |
1996 |
| Předmět: |
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| Zdroj: |
Metrology, Inspection, and Process Control for Microlithography X. |
| ISSN: |
0277-786X |
| DOI: |
10.1117/12.240086 |
| Popis: |
A patterned wafer inspection system using optical pattern filtering (OPF) has been integrated into sub-half micron semiconductor device pilot production lines (125 mm and 200 mm) for the purpose of process defect control. The optical pattern filtering tool offers the advantages of 0.2 micrometer or better sensitivity with high throughput as compared to other patterned wafer inspection systems, and offers exceptional ability to find defects located deep inside the patterns of a typical device. This three dimensional capability offers unique capability when inspecting contacts or vias. A highly repetitive pattern must be used with the OPF tool. However, this limitation is easily overcome by using large highly repetitive arrays such as those found on DRAM or SRAM technologies. Additionally, the use of specially designed highly repetitive defect array masks such as a diffraction grating (comb) or a series of highly repetitive holes (vias and contacts) can be used.© (1996) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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