Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints
Autor: | King-Ning Tu, Chih Chen, H. M. Tong |
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Rok vydání: | 2010 |
Předmět: | |
Zdroj: | Annual Review of Materials Research. 40:531-555 |
ISSN: | 1545-4118 1531-7331 |
Popis: | Pb-free solders have replaced Pb-containing SnPb solders in the electronic packaging industry due to environmental concerns. Both electromigration (EM) and thermomigration (TM) have serious reliability issues for fine-pitch Pb-free solder bumps in the flip-chip technology used in consumer electronic products. We review the unique features of EM and TM in flip-chip solder bumps, emphasizing the effects of current crowding and Joule heating. In addition, the challenges to a better understanding of EM and TM in Pb-free solders are discussed. For example, the anisotropic nature of Sn microstructure in Pb-free solders can enhance the dissolution rates of Ni and Cu in solders driven by EM and TM. |
Databáze: | OpenAIRE |
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