Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints

Autor:	King-Ning Tu, Chih Chen, H. M. Tong
Rok vydání:	2010
Předmět:	Materials science Soldering Metallurgy Current crowding Electronic packaging General Materials Science Joule heating Microstructure Electromigration Flip chip
Zdroj:	Annual Review of Materials Research. 40:531-555
ISSN:	1545-4118 1531-7331
Popis:	Pb-free solders have replaced Pb-containing SnPb solders in the electronic packaging industry due to environmental concerns. Both electromigration (EM) and thermomigration (TM) have serious reliability issues for fine-pitch Pb-free solder bumps in the flip-chip technology used in consumer electronic products. We review the unique features of EM and TM in flip-chip solder bumps, emphasizing the effects of current crowding and Joule heating. In addition, the challenges to a better understanding of EM and TM in Pb-free solders are discussed. For example, the anisotropic nature of Sn microstructure in Pb-free solders can enhance the dissolution rates of Ni and Cu in solders driven by EM and TM.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::c9e2c51f2e7cb62a8d3fdfcc37cfa902 https://doi.org/10.1146/annurev.matsci.38.060407.130253 Zobrazit plný text záznamu