Panel level IC-package technology development

Autor:	Jen-Kuang Fang, Cher-Min Fong, Wen-Long Lu, Peng Yang
Rok vydání:	2022
Předmět:	Electrical and Electronic Engineering Safety Risk Reliability and Quality Condensed Matter Physics Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials
Zdroj:	Microelectronics Reliability. 136:114657
ISSN:	0026-2714
DOI:	10.1016/j.microrel.2022.114657
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::c7869d69c87bbb6d30f657151fe6bf9d https://doi.org/10.1016/j.microrel.2022.114657 Zobrazit plný text záznamu Full Text from ScienceDirect