An investigation of bonding mechanism for Au-Al solid-phase diffusion flip chip bonding

Autor:	Yukio Kizaki, Miki Mori, Yumi Fukuda, Atsuko Iida
Rok vydání:	1997
Předmět:	Materials science Chemical engineering Computer Networks and Communications Anodic bonding General Physics and Astronomy Phase diffusion Thermocompression bonding Electrical and Electronic Engineering Mechanism (sociology) Flip chip
Zdroj:	Electronics and Communications in Japan (Part II: Electronics). 80:9-17
ISSN:	1520-6432 8756-663X
DOI:	10.1002/(sici)1520-6432(199710)80:10<9::aid-ecjb2>3.0.co;2-4
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::c38011fd40f0c07b245c77890b3621bc https://doi.org/10.1002/(sici)1520-6432(199710)80:10<9::aid-ecjb2>3.0.co Zobrazit plný text záznamu Plný text ve formátu PDF