| Autor: |
Wenqiang Wei, Peilian Liu, J. Y. Zhang, Shan-shan Cui, Z.G. Wang, Zhijun Li, Yuanbo Chen, X. S. Jiang, H.C. Li, Kui Zhu |
| Rok vydání: |
2021 |
| Předmět: |
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| Zdroj: |
Journal of Instrumentation. 16:P08004 |
| ISSN: |
1748-0221 |
| DOI: |
10.1088/1748-0221/16/08/p08004 |
| Popis: |
HEPS-BPIX3 is a hybrid pixel detector readout chip for X-ray applications for the High Energy Photon Source (HEPS) in China. The readout chip contains an array of 88 × 88 pixels with a pixel size of 55 μm × 55 μm, working in single photon counting mode. Each pixel handles both polarities of positive and negative input charge signals and has a counting depth of 11 bits. Using a clock with a frequency up to 160 MHz, the chip can read out serially with zero dead time. Designed in a 130 nm CMOS technology, the chip has been measured and given the CSA charge gain of 17.6 mV/ke- for electron collection and 13 mV/ke- for hole collection, respectively. Bump-bonded detector modules with a 320-μm-thick silicon sensor were also tested. The test results showed an equivalent input noise of 156 e- and a counting rate up to 2.2 Mcps. Besides, an image using an X-ray tube was demonstrated and a frame rate of 1.8 kHz could be guaranteed. Measured characteristics present the normal functionality of the HEPS-BPIX3 chip and prove that the chip satisfies the HEPS requirements. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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