Silicon-organic hybrid (SOH) integration and photonic multi-chip systems: Technologies for high-speed optical interconnects

Autor:	Koos, Christian, Freude, Wolfgang, Leuthold, J., Dalton, L. R., Wolf, Stefan M., Zwickel, H., Hoose, Tobias, Billah, Muhammad Rodlin, Lauermann, Matthias, Weimann, Claudius, Hartmann, Wladislaw, Melikyan, Argishti, Lindenmann, Nicole, Koeber, Sebastian, Palmer, Robert, Korn, Dietmar, Alloatti, Luca, Giesecke, A.-L., Wahlbrink, T.
Jazyk:	angličtina
Předmět:	Physics::Instrumentation and Detectors silicon-organic hybrid (SOH) integration optical interconnects ComputingMethodologies_IMAGEPROCESSINGANDCOMPUTERVISION Silicon photonics Physics::Optics Hardware_PERFORMANCEANDRELIABILITY 7. Clean energy photonic wire bonding multi-chip integration Computer Science::Hardware Architecture Hardware_INTEGRATEDCIRCUITS plasmonic-organic hybrid (SOH) integration ComputingMethodologies_COMPUTERGRAPHICS
Popis:	Limitations of silicon photonics can be overcome by hybrid integration of silicon photonic or plasmonic circuits with organic materials or by photonic multi-chip systems. We give an overview on our recent progress regarding both silicon-organic hybrid (SOH) integration and multi-chip integration enabled by photonic wire bonding.
Databáze:	OpenAIRE
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