Investigation of failure mechanism of aluminum-scandium wire bond contact under active power cycle test

Autor:	Tadashi Yamaguchi, Yuya Suto, Noritoshi Araki, Motoki Eto, Felix Fischer, Anne Groth
Rok vydání:	2023
Předmět:	Electrical and Electronic Engineering Safety Risk Reliability and Quality Condensed Matter Physics Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials
Zdroj:	Microelectronics Reliability. 144:114956
ISSN:	0026-2714
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::bdbe69e4b399fcd8e4b13e2a8bf697e7 https://doi.org/10.1016/j.microrel.2023.114956 Zobrazit plný text záznamu Full Text from ScienceDirect