| Autor: |
Samia Rahman, Satyaki Ganguly, Martin von Haartman, Ahmad Umair, Jai Verma, Tristan Deborde |
| Rok vydání: |
2015 |
| Předmět: |
|
| Zdroj: |
International Symposium for Testing and Failure Analysis. |
| ISSN: |
0890-1740 |
| DOI: |
10.31399/asm.cp.istfa2015p0052 |
| Popis: |
Resolution of optical fault isolation (FI) and nanoprobing tools needs to keep pace with the device downscaling to be effective for semiconductor process development. In this paper we present and discuss state-of-the-art FI and nanoprobing techniques evaluated on Intel test-chips fabricated on next generation process technology. Promising results were obtained but further improvements are necessary for the 7nm node and beyond. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
|
