Atomic force microscopy nano-indentation for testing mechanical properties in thin films

Autor:	Martin Sirena, N. Haberkorn, Simón Roa
Rok vydání:	2019
Předmět:	010302 applied physics Materials science Atomic force microscopy Young's modulus 02 engineering and technology Nanoindentation 021001 nanoscience & nanotechnology 01 natural sciences symbols.namesake 0103 physical sciences symbols Coupling (piping) Composite material Thin film 0210 nano-technology
Zdroj:	Materials Today: Proceedings. 14:113-116
ISSN:	2214-7853
DOI:	10.1016/j.matpr.2019.05.065
Popis:	We study the mechanical properties of Cu thin films on Si (100) by performing nano-indentation using an atomic force microscopy. Cu films with thickness of 0.3 µm, 1 µm and 2 µm were analyzed. Area profile studies let us understand the critical influence of the indenter geometry uncertainty on the estimation of the mechanical properties. This seems to be very important when studying thin films because penetrations depths are very small and close to the indenter apex which could have geometrical discontinuities. We found that the hardness of the samples and Young modulus decreases as the film thickness increases. The origin of this behavior could be ascribed to a substrate-film mechanical coupling or a microstructural effect.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::ba302b648b8d28f8065f491f9c5dec5d https://doi.org/10.1016/j.matpr.2019.05.065 Zobrazit plný text záznamu Full Text from ScienceDirect